Black Cushion Grade Static Dissipative Foam

• This foam provides protection from physical shock during handling, packaging, and storage of ESD sensitive devices
• Static dissipative RTT 10E7 – 10E9 ; ideal for controlled electrostatic charge removal

Black Cushion Grade Conductive Foam

• This foam provides protection from physical shock during handling, packaging, and storage of ESD sensitive devices
• Conductive crosslink polyethylene RTT 10E3 – 10E4 ohms

Item	Description	Price	Promo Price
37680	1/8″ x 37″ x 57″	$37.77	$32.10
37681	1/4″ x 37″ x 57″	$80.19	$68.16
37682	3/8″ x 37″ x 57″	$105.45	$89.63
37683	1/2″ x 37″ x 57″	$160.99	$136.84

Black Lead Insertion Grade Conductive Foam

• Ideal for lead insertion packaging, providing ESD and physical protection to component leads
• Conductive crosslink polyethylene foam, RTT < 10E4 ohms

Item	Description	Price	Promo Price
37704	1/8″ x 36″ x 60″	$34.92	$29.68
37705	1/4″ x 36″ x 60″	$64.94	$55.20
37706	3/8″ x 36″ x 60″	$84.34	$71.69
37707	1/2″ x 36″ x 60″	$129.34	$109.94

Convenient method for securing paperwork throughout the ESD protective area

• Part numbers 47515 – 47519 have full adhesive back
• Transparent clear material allows bar code scanning
• Imprinted with ESD Protective Symbol
• Packaged 25 per pack, 50 for 47518 and 47519
• Made in United States of America

Online orders only. This cannot be combined with any other Protektive Pak promotional offer.
Not Valid on Custom Orders

• Economical method of storing reels
• Compact for use in limited space areas
• Convenient for use on workstation
• Available in 7” and 13”
• Reel Storage Containers are stackable
  and include identification labels
• Reusable, ensuring best value
• Dissipative impregnated corrugated material
• Each reel storage box has 5 cells for efficient storage
• Partitions are easily removed to accommodate wider reels
• Lead-free RoHS compliant
• Made in the United States of America

100% Recycled – 100% Recyclable

What percentage of electronic failures are latent defects? What’s the cost to industry? According to the ESD Association “It is relatively easy with the proper equipment to confirm that a device has experienced catastrophic failure. Basic performance tests will substantiate device damage. However, latent defects are extremely difficult to prove or detect using current technology, especially after the device is assembled into a finished product.” So there is the view that, by definition, it is impossible to quantify the amount of latent damage. However, for most companies, the cost of customer returns and field service warranty expense greatly exceeds in-house scrap & re-work expense.

Per the ESD Association: “The age of electronics brought with it new problems associated with static electricity and electrostatic discharge. And, as electronic devices became faster and smaller, their sensitivity to ESD increased. Today, ESD impacts productivity and product reliability in virtually every aspect of today’s electronics environment. Industry experts have estimated average product losses due to static to range [up to] 33%. Others estimate the actual cost of ESD damage to the electronics industry as running into the billions of dollars annually.”

For ESD Fundamentals from the ESD Association web site at Click Here

Some major companies report that 25% of all identified electronic part failure is due to ESD. As an ESD Control Program improves, a resulting decrease in unidentified field failures and ”no problem found” returns should occur. Reducing latent defect field failures is what allows companies to report return on investments of 10:1 from their ESD Control Programs.

To continue reading The “Real” Cost of ESD Damage Click Here.

In general, the ESD susceptibility of modern electronics are more sensitive to ElectroStatic Discharge; that is the withstand voltages are lower. This is due to the drive for miniaturization particularly with electronic devices operating faster. Thus the semiconductor circuitry is getting smaller.

See November 2001 Evaluation Engineering Magazine article “ESD Control Program Development” “As the drive for miniaturization has reduced the width of electronic device structures to as small as 0.10 micrometer (equal to 0.0001 millimeter or 0.000004 inch), electronic components are being manufactured with increased ElectroStatic Discharge (ESD) susceptibility.”

What’s happening currently? Intel began selling its 32 nm processors in 2010 that would be 0.032 micrometer equal to 0.000032 millimeter or 0.00000128 inch.

See www.ESDA.org, the ESD Association’s latest White Paper “Electrostatic Discharge (ESD) Technology Roadmap – Revised April 2010” forecasts increased ESD sensitivities continuing the recent “trend, the ICs became even more sensitive to ESD events in the years between 2005 and 2009. Therefore, the prevailing trend is circuit performance at the expense of ESD protection levels.” The White Paper’s conclusions are:

“With devices becoming more sensitive through 2010-2015 and beyond, it is imperative that companies begin to scrutinize the ESD capabilities of their handling processes. Factory ESD control is expected to play an ever-increasing critical role as the industry is flooded with even more HBM and CDM sensitive designs. For people handling ESD sensitive devices, personnel grounding systems must be designed to limit body voltages to less than 100 volts.

To protect against metal-to-device discharges, all conductive elements that contact ESD sensitive devices must be grounded.

To limit the possibilities of a field induced CDM ESD event, users of ESD sensitive devices should ensure that the maximum voltage induced on their devices is kept below 50 volts.

To limit CDM ESD events, device pins should be contacted with static-dissipative material instead of metal wherever possible.”

See InCompliance Magazine May 2010 article by Dr. Terry L. Welsher The “Real” Cost of ESD Damage which includes “Recent data and experience reported by several companies and laboratories now suggest that many failures previously classified as EOS may instead be the result of ESD failures due to Charged Board Events (CBE). … Some companies have estimated that about 50% of failures originally designated as EOS were actually CBE or CDE.”

To see Protektive Pak’s video channel Click Here.

1. (1) Human Body Model (HBM) [100 pF @ 1.5 kilohms], ESD STM5.1
2. (2) Charge Device Model (CDM) [4 pF/30 pF], ESD DS5.3.1
3. (3) Machine Model (MM) [200 pF @ 0 ohms], ESD STM5.2

Human Body Model
The most common model is the HBM. This model simulates when a discharge occurs between a human (hand/finger) to a conductor (metal rail). The equivalent capacitance is 100 picofarads (100 x 10^-12 Farads) and equivalent resistance is 1,500 ohms to simulate a human body. The typical rise time of the current pulse (ESD) through a shorting wire averages 6 nanoseconds (6×10^-9 s) and larger for a higher resistant load. The peak current through a 500 ohm resistor averages 463 mA for a 1,000 volt pre-charge voltage.

Per ESD-STM5.1 Human Body Model (HBM)Component Level paragraph 4
Table 1-HBM ESDS Component Classification

To continue reading about ESD Classifications Click Here

What is Desiccant?

Desiccant is a drying agent that is used to absorb moisture from the air inside moisture barrier bags. Desiccant absorbs moisture vapor (humidity) from the air left inside that barrier bag after it has been
sealed. Any moisture that penetrates the bag will also be absorbed. Desiccant remains dry to the touch
even when it is fully saturated with moisture vapor.

How is Desiccant Purchased?

Desiccant is sold by the “Unit” or fractional Unit. One unit of desiccant will absorb a specific amount of moisture. A unit weighs about 28 grams or 1 ounce. The pouches of desiccant are placed into metal pails to keep the desiccant dry during shipping and storage.

To continue reading Click Here

To see available Desiccants Click Here

Plastek™ Features

• Provides physical protection with conductive material providing reliable path-to-ground
• Includes wire frame for extra strength
• Product ships flat – easy assembly
• Rtt: 10E2 – 10E4 ohms
• Made in the United States of America

Options

• Conductive Plastic Handles available
• Static Dissipative Foam for bottom, providing ESD and shock protection
• Document Holders
• Lid
• Made in the United States of America
  Click here to view New39300